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All projects

Every project ever made at MAROIS – PCs, gadgets, modifications, hardware parts and prototypes – with story, highlights and, where available, the parts list. Some were sold, some are still on the desk, some stayed a concept.

CAN
CAN
Prototypen · 2025
Cylindrical Mini-ITX tower case with handle and carbon look – fully designed in CAD, never built. A concept that set the direction for “round shapes from the printer”.
Concept
Details

Cylindrical Mini-ITX tower · integrated handle · carbon look · segmented for 3D printing · concept, not realised

Render: open shell with visible hardwareRender: graphics card behind the slotRender: closed shellCAD: individual parts and segmentation

CAN is a thought experiment in form: a round tower that stacks the hardware vertically – PSU at the bottom, motherboard in the middle, graphics card behind a slot in the outer skin, and a handle on top like a toolbox. The outer shell in a carbon look, the inside a structure of rings that could be printed.

The project stayed in CAD. But it answered questions that later fed into GLAS, CLICK and M3DLP: how to route air through a round body, where to place the handle so the balance is right, and how to split a case into printable segments.

RAM Cooling
RAM Cooling
Prototypen · 2026
RAM cooler for four standard modules: the cheap stock heat spreaders removed, a milled aluminium body bolted to each module, all four joined into one block by 3D-printed carbon frames.
Completed
Details

Four standard modules · milled aluminium heat sinks, bolted · connecting frames in PETG-carbon (3D print) · prototype, tested

Four standard RAM modules, four thin sheet-metal heat spreaders – more looks than cooling. RAM Cooling replaces them: the original heat spreaders were removed, each module received a milled aluminium body, bolted on rather than glued. 3D-printed PETG-carbon frames join the four modules into one block sitting in the case airflow.

A workshop prototype – milling, printing, checking the fit. The goal: keep high-clock RAM stable and cool without switching to expensive modules with factory heat sinks.